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APR2/D 数据表(PDF) 20 Page - NXP Semiconductors |
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APR2/D 数据表(HTML) 20 Page - NXP Semiconductors |
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20 / 101 page ![]() 2-2 DSP56001A/D, Rev. 1 MOTOROLA DSP56001A General Characteristics Table 2-4 Thermal Characteristics for 132-pin CQFP/PQFP Packages Thermal Resistance Symbol Value Rating Junction to Ambient RθJA 40 (CQFP) 47 (PQFP) °C/W Junction to Case (estimated) RθJC 7.0 (CQFP) 13.0 (PQFP) °C/W Note: 1. See discussion under Design Considerations, Heat Dissipation, page 4-1. 2. Junction-to-ambient thermal resistance is based on measurements on a horizontal single-sided Printed Circuit Board per SEMI G38-87 in natural convection. SEMI is Semiconductor Equipment and Materials International, 805 East Middlefield Road, Mountain View, CA 94043, (415) 964-5111. 3. Junction-to-case thermal resistance is based on measurements using a cold plate per SEMI G30-88 with the exception that the cold plate temperature is used for the case temperature. Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com |
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