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APR2/D 数据表(PDF) 79 Page - NXP Semiconductors |
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APR2/D 数据表(HTML) 79 Page - NXP Semiconductors |
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79 / 101 page ![]() DSP56001A Heat Dissipation MOTOROLA DSP56001A/D, Rev. 1 4-5 HEAT DISSIPATION The average chip junction temperature, TJ, in °C, can be obtained from: Equation 1: T J = TA + (PD × ΘJA) Where: TA = ambient temperature, °C Θ JA = package thermal resistance, junction-to-ambient, °C/W PD = PINT + PI/O PINT = ICC × VCC watt—chip internal power PI/O = power dissipation on input and output pins—user determined For most applications PI/O < PINT and PI/O can be neglected. An appropriate relationship between PD and TJ (if PI/O is neglected) is: Equation 2: P D = K / (TJ + 273) Solving equations (1) and (2) for K gives: Equation 3: K = P D × (TA + 273) + PD × ΘJA Where: K is a constant pertaining to the particular package K can be determined from equation (2) by measuring PD (at equilibrium) for a known TA. Using this value of K, the values of PD and TJ can be obtained by solving equations (1) and (2) iteratively for any value of TA. The total thermal resistance of a package (ΘJA) can be separated into two components, Θ JC and ΘCA, representing the barrier to heat flow from the semiconductor junction to the package (case) surface ( Θ JC) and from the case to the outside ambient (ΘCA). These terms are related by the equation: Equation 4: Θ JA = ΘJC + ΘCA Θ JC is device-related and cannot be influenced by the user. However, ΘCA is user-dependent and can be minimized by thermal management techniques such as heat sinks, ambient air cooling, and thermal convection. Thus, good thermal management can significantly reduce Θ CA so that Θ JA approximately equals ΘJC. Values for thermal resistance presented in this document, unless estimated, were derived using the procedure described in Motorola Reliability Report 7843, “Thermal Resistance Measurement Method for MC68XX Microcomponent Devices”, and are provided for design purposes only. Thermal measurements are complex and dependent on procedure and setup. User-derived values for thermal resistance may differ. Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com |
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