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GXM 数据表(PDF) 34 Page - National Semiconductor (TI) |
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GXM 数据表(HTML) 34 Page - National Semiconductor (TI) |
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34 / 244 page ![]() www.national.com 34 Revision 3.1 Signal Definitions (Continued) 2.3 SUBSYSTEM SIGNAL CONNECTIONS As previously stated, the GXm Integrated Subsystem with MMX support consists of two chips: the GXm Processor and the CS5530 I/O companion. Figure 2-4 shows the signal connections between the processor and the I/O companion chip. Figure 2-4. Subsystem Signal Connections SYSCLK SERIALP IRQ13 SMI# PCLK CRT_HSYNC CRT_VSYNC PIXEL[17:0] FP_HSYNC FP_VSYNC ENA_DISP VID_VAL VID_CLK VID_DATA[7:0] VID_RDY INTR SUSP# SUSPA# AD[31:0] C/BE[3:0]# PAR FRAME# IRDY# TRDY# STOP# LOCK# DEVSEL# PERR# SERR# REQ0# GX_CLK PSERIAL IRQ13 SMI# PCLK HSYNC VSYNC PIXEL[23:0] FP_HSYNC FP_VSYNC FP_ENA_DISP VID_VAL VID_CLK VID_DATA[7:0] VID_RDY CPU_RST INTR SUSP# SUSPA# AD[31:0] C/BE[3:0]# PAR FRAME# IRDY# TRDY# STOP# LOCK# DEVSEL# PERR# SERR# REQ# GNT# GNT0# Geode™ CS5530 I/O Companion Exclusive Interconnect Signals (Do not connect to any other device) Nonexclusive Interconnect Signals (May also connect to other circuitry) Not needed if CRT only (no TFT) (Note) Note: Refer to Figure 2-5 for interconnection of these lines. RESET DCLK DCLK Geode™ GXm Processor |
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