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数据搜索系统，热门电子元器件搜索 |
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数据搜索系统，热门电子元器件搜索 |
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GXM 数据表(PDF) 36 Page - National Semiconductor (TI) |
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GXM 数据表(HTML) 36 Page - National Semiconductor (TI) |
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36 / 244 page  www.national.com 36 Revision 3.1 Signal Definitions (Continued) 2.4 POWER PLANES Figure 2-6 shows layout recommendations for splitting the power plane between VCC2 (core: 2.9V) and VCC3 (I/O: 3.3V) volts in the BGA package. The illustration assumes there is one power plane, and no components on the back of the board Figure 2-7 shows layout recommendations for splitting the power plane between VCC2 (core: 2.9V) and VCC3 (I/O: 3.3V) volts for the GXm in the SPGA package. Figure 2-6. BGA Recommended Split Power Plane and Decoupling 1 26 A AF AF A 26 1 = High frequency capacitor = 220µF, low ESR capacitor = 3.3V connection = 2.9V connection Geode™ GXm 352 BGA - Top View 2.9V Plane (VCC2) 3.3V Plane (VCC3) 3.3V Plane (VCC3) 3.3V Plane (VCC3) 2.9V Plane (VCC2) Legend Processor |
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