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EM357-RTR 数据表(PDF) 226 Page - Silicon Laboratories |
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EM357-RTR 数据表(HTML) 226 Page - Silicon Laboratories |
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226 / 241 page ![]() 226 Rev 1.3 Table 20.1 contains the temperature profile parameters. Table 20.1. Solder Reflow Parameters Parameter Value Average Ramp Up Rate (from Tsoakmax to Tpeak) 3 °C per second max Minimum Soak Temperature (Tsoakmin) 150 °C Maximum Soak Temperature (Tsoakmax) 200 °C TL 21 7°C Time above TL 60–150 seconds Tpeak 260 + 0 °C Time within 5 °C of Tpeak 20–40 seconds Ramp Down Rate 6 °C per second max Time from 25 °C to Tpeak 8 minutes, max |
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