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EM357-RTR 数据表(PDF) 4 Page - Silicon Laboratories

部件名 EM357-RTR
功能描述  High-Performance, Integrated ZigBee/802.15.4 System-on-Chip
PDF  241 Pages
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制造商  SILABS [Silicon Laboratories]
网页  http://www.silabs.com
标志 SILABS - Silicon Laboratories

EM357-RTR 数据表(HTML) 4 Page - Silicon Laboratories

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Rev 1.3
8.4. SPI - Slave Mode .........................................................................................................84
8.5. TWI - Two Wire serial Interfaces ..................................................................................87
8.6. UART - Universal Asynchronous Receiver / Transmitter .............................................93
8.7. DMA Channels ...........................................................................................................101
9. General Purpose Timers (TIM1 and TIM2) ..................................................................... 114
9.1. Introduction.................................................................................................................114
9.2. GPIO Usage ...............................................................................................................116
9.3. Timer Functional Description......................................................................................116
9.4. Interrupts ....................................................................................................................144
9.5. Registers ....................................................................................................................145
10. ADC (Analog to Digital Converter) ................................................................................. 172
10.1.Setup and Configuration ............................................................................................173
10.2.Interrupts....................................................................................................................176
10.3.Operation ...................................................................................................................177
10.4.Calibration..................................................................................................................178
10.5.ADC Key Parameters.................................................................................................179
10.6.Registers....................................................................................................................183
11. Interrupt System .............................................................................................................. 190
11.1.Nested Vectored Interrupt Controller (NVIC) .............................................................190
11.2.Event Manager...........................................................................................................192
11.3.Non-Maskable Interrupt (NMI) ...................................................................................195
11.4.Faults .........................................................................................................................195
11.5.Registers....................................................................................................................196
12. Trace Port Interface Unit (TPIU)...................................................................................... 203
13. Instrumentation Trace Macrocell (ITM) .......................................................................... 204
14. Data Watchpoint and Trace (DWT) ................................................................................. 205
15. Flash Patch and Breakpoint (FPB) ................................................................................. 206
16. Integrated Voltage Regulator.......................................................................................... 207
17. Serial Wire and JTAG (SWJ) Interface ........................................................................... 209
18. Ordering Information ....................................................................................................... 210
19. Pin Definitions.................................................................................................................. 211
19.1.Pin Definitions ............................................................................................................211
20. Package ............................................................................................................................ 223
20.1.QFN48 Footprint Recommendations .........................................................................223
20.2.Solder Temperature Profile........................................................................................225
21. Top Marking...................................................................................................................... 227
22. Shipping Box Label ......................................................................................................... 228
Appendix A—Register Address Table................................................................................. 229
Appendix B—Abbreviations and Acronyms....................................................................... 235
Appendix C—References ..................................................................................................... 239
Document Change List ......................................................................................................... 240
Contact Information .............................................................................................................. 241



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