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ADAU1772BCPZ-R7 数据表(PDF) 16 Page - Analog Devices

部件名 ADAU1772BCPZ-R7
功能描述  Four ADC, Two DAC Low Power Codec
PDF  117 Pages
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制造商  AD [Analog Devices]
网页  http://www.analog.com
标志 AD - Analog Devices

ADAU1772BCPZ-R7 数据表(HTML) 16 Page - Analog Devices

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Data Sheet
ADAU1772
Rev. C | Page 15 of 116
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
Figure 9. Pin Configuration
Table 10. Pin Function Descriptions
Pin No.
Mnemonic
Type1
Description
1
SDA/MISO
D_IO
I2C Data (SDA). This pin is a bidirectional open-collector. The line connected to this pin should have
a 2.0 kΩ pull-up resistor.
SPI Data Output (MISO). This SPI data output is used for reading back registers and memory locations.
It is tristated when an SPI read is not active.
2
SCL/SCLK
D_IN
I2C Clock (SCL). This pin is always an open-collector input when the device is in I2C control mode.
When the device is in self-boot mode, this pin is an open-collector output (I2C master). The line
connected to this pin should have a 2.0 kΩ pull-up resistor.
SPI Clock (SCLK). This pin can either run continuously or be gated off between SPI transactions.
3
ADDR1/MOSI
D_IN
I2C Address 1 (ADDR1).
SPI Data Input (MOSI).
4
ADDR0/SS
D_IN
I2C Address 0 (ADDR0).
SPI Latch Signal (SS). This pin must go low at the beginning of an SPI transaction and high at the
end of a transaction. Each SPI transaction can take a different number of SCLK cycles to complete,
depending on the address and read/write bit that are sent at the beginning of the SPI transaction.
5
SELFBOOT
D_IN
Self-Boot. Pull this pin up to IOVDD at power-up to enable the self-boot mode.
6
MICBIAS0
A_OUT
Bias Voltage for Electret Microphone. Decouple with a 1 µF capacitor.
7
MICBIAS1
A_OUT
Bias Voltage for Electret Microphone. Decouple with a 1 µF capacitor.
8
AIN0REF
A_IN
ADC0 Input Reference. This reference pin should be ac-coupled to ground with a 10 µF capacitor.
9
AIN0
A_IN
ADC0 Input.
10
AVDD
PWR
1.8 V to 3.3 V Analog Supply. This pin should be decoupled to AGND with a 0.1 μF capacitor.
11
AGND
PWR
Analog Ground. The AGND and DGND pins can be tied directly together in a common ground plane.
AGND should be decoupled to AVDD with a 0.1 μF capacitor.
12
CM
A_OUT
AVDD/2 V Common-Mode Reference. A 10 μF to 47 μF decoupling capacitor should be connected
between this pin and ground to reduce crosstalk between the ADCs and DACs. The material of the
capacitors is not critical. This pin can be used to bias external analog circuits, as long as they are
not drawing current from CM (for example, the noninverting input of an op amp).
1
SDA/MISO
2
SCL/SCLK
3
ADDR1/MOSI
4
ADDR0/SS
5
SELFBOOT
6
MICBIAS0
7
MICBIAS1
8
AIN0REF
9
AIN0
10
AVDD
23 AGND
24 AVDD
25 HPOUTRN/LOUTRN
26 HPOUTRP/LOUTRP
27 PD
28 REG_OUT
29 DVDD
30 DGND
22 HPOUTLP/LOUTLP
21 HPOUTLN/LOUTLN
TOP VIEW
(Not to Scale)
ADAU1772
NOTES
1. THE EXPOSED PAD IS CONNECTED INTERNALLY TO THE ADAU1772
GROUNDS. FOR INCREASED RELIABILITY OF THE SOLDER JOINTS AND
MAXIMUM THERMAL CAPABILITY, IT IS RECOMMENDED THAT THE PAD
BE SOLDERED TO THE GROUND PLANE. SEE THE EXPOSED PAD PCB
DESIGN SECTION FOR MORE INFORMATION.



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