H8SSLASH2214 datasheet(4/936 Pages) RENESAS

4 / 936 page

Rev.4.00 Sep. 18, 2008 Page iv of lx

REJ09B0189-0400

Configuration of this Manual

This manual comprises the following items:

1. General Precautions in the Handling of MPU/MCU Products

2. Configuration of this Manual

3. Overview

4. Table of Contents

5. Summary

6. Description of Functional Modules

•

CPU and System-Control Modules

•

On-chip Peripheral Modules

The configuration of the functional description of each module differs according to the

module. However, the generic style includes the following items:

i) Features

ii) I/O pins

iii) Description of Registers

iv) Description of Operation

v) Usage: Points for Caution

When designing an application system that includes this LSI, take the points for caution into

account. Each section includes points for caution in relation to the descriptions given, and points

for caution in usage are given, as required, as the final part of each section.

7. List of Registers

8. Electrical Characteristics

9. Appendix

•

Product-type codes and external dimensions

•

Main Revisions for this edition

The history of revisions is a summary of sections that have been revised and sections that have

been added to earlier versions. This does not include all of the revised contents. For details,

confirm by referring to the main description of this manual.

10. Appendix/Appendices

H8S/2214 数据表(PDF) 4 Page - Renesas Technology Corp

H8S/2214 数据表(HTML) 4 Page - Renesas Technology Corp

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 ...More

数据表下载