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H8S/2214 数据表(PDF) 46 Page - Renesas Technology Corp |
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H8S/2214 数据表(HTML) 46 Page - Renesas Technology Corp |
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46 / 936 page ![]() Rev.4.00 Sep. 18, 2008 Page xlvi of lx REJ09B0189-0400 Figure 4.3 Reset Sequence (Mode 4).......................................................................................... 85 Figure 4.4 Interrupt Sources and Number of Interrupts.............................................................. 87 Figure 4.5 Stack Status after Exception Handling (Normal Modes: Not available in the H8S/2214)...................................................... 89 Figure 4.6 Stack Status after Exception Handling (Advanced Modes) ...................................... 89 Figure 4.7 Operation when SP Value Is Odd.............................................................................. 90 Section 5 Interrupt Controller Figure 5.1 Block Diagram of Interrupt Controller...................................................................... 92 Figure 5.2 Block Diagram of Interrupts IRQn.......................................................................... 100 Figure 5.3 Timing of Setting IRQnF ........................................................................................ 100 Figure 5.4 Block Diagram of Interrupt Control Operation ....................................................... 105 Figure 5.5 Flowchart of Procedure Up to Interrupt Acceptance in Interrupt Control Mode 0.. 108 Figure 5.6 Flowchart of Procedure Up to Interrupt Acceptance in Interrupt Control Mode 2.. 110 Figure 5.7 Interrupt Exception Handling.................................................................................. 111 Figure 5.8 Contention between Interrupt Generation and Disabling ........................................ 114 Figure 5.9 Interrupt Control for DTC and DMAC ................................................................... 116 Section 6 Bus Controller Figure 6.1 Block Diagram of Bus Controller ........................................................................... 120 Figure 6.2 Overview of Area Divisions.................................................................................... 134 Figure 6.3 CSn Signal Output Timing (n = 0 to 7) ................................................................... 138 Figure 6.4 Access Sizes and Data Alignment Control (8-Bit Access Space) ........................... 139 Figure 6.5 Access Sizes and Data Alignment Control (16-Bit Access Space) ......................... 140 Figure 6.6 Bus Timing for 8-Bit 2-State Access Space ............................................................ 142 Figure 6.7 Bus Timing for 8-Bit 3-State Access Space ............................................................ 143 Figure 6.8 Bus Timing for 16-Bit 2-State Access Space (Even Address Byte Access)............ 144 Figure 6.9 Bus Timing for 16-Bit 2-State Access Space (Odd Address Byte Access) ............. 145 Figure 6.10 Bus Timing for 16-Bit 2-State Access Space (Word Access) ................................. 146 Figure 6.11 Bus Timing for 16-Bit 3-State Access Space (Even Address Byte Access)............ 147 Figure 6.12 Bus Timing for 16-Bit 3-State Access Space (Odd Address Byte Access) ............. 148 Figure 6.13 Bus Timing for 16-Bit 3-State Access Space (Word Access) ................................. 149 Figure 6.14 Example of Wait State Insertion Timing................................................................. 151 Figure 6.15 Example of Burst ROM Access Timing (When AST0 = BRSTS1 = 1).................. 153 Figure 6.16 Example of Burst ROM Access Timing (When AST0 = BRSTS1 = 0).................. 154 Figure 6.17 Example of Idle Cycle Operation (1) ...................................................................... 155 Figure 6.18 Example of Idle Cycle Operation (2) ...................................................................... 156 Figure 6.19 Relationship between Chip Select ( CS) and Read (RD) ......................................... 157 Figure 6.20 Bus-Released State Transition Timing.................................................................... 161 Figure 6.21 Multichip Block Diagram........................................................................................ 165 Figure 6.22 Timing of External Module Area Access by DTC .................................................. 171 |
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