SIO1007 datasheet(103/108 Pages) MICROCHIP

103 / 108 page

 2005 - 2015 Microchip Technology Inc.

DS00002020A-page 103

SIO1007

22.0

PACKAGE OUTLINE

Note 1: Controlling Unit: millimeter.

2: Tolerance on the true position of the leads is ± 0.035 mm maximum.

3: Package body dimensions D1 and E1 do not include the mold protrusion.

4: Maximum mold protrusion is 0.25 mm per side. D1 and E1 dimensions determined at datum plane H.

5: Dimension for foot length L measured at the gauge plane 0.25 mm above the seating plane.

6: Details of pin 1 identifier are optional but must be located within the zone indicated.

Note:

For the most current package drawings, see the Microchip Packaging Specification at http://www.microchip.com/packaging.

FIGURE 22-1:

64-PIN STQFP PACKAGE

Min

Nominal

Max

Remarks

1.60

Overall Package Height

0.05

0.15

Standoff

1.35

1.40

1.45

Body Thickness

8.80

9.00

9.20

X Span

6.80

7.00

7.20

X body Size

8.80

9.00

9.20

Y Span

6.80

7.00

7.20

Y body Size

0.09

0.20

Lead Frame Thickness

0.45

0.60

0.75

Lead Foot Length

1.00 REF.

Lead Length

0.40 Basic

Lead Pitch



~7o

Lead Foot Angle

0.13

0.18

0.23

Lead Width

ccc

0.08

Coplanarity

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