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CY8CKIT-059 数据表(PDF) 30 Page - Infineon Technologies AG |
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CY8CKIT-059 数据表(HTML) 30 Page - Infineon Technologies AG |
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30 / 140 page ![]() Document Number: 001-84932 Rev. *N Page 29 of 139 PSoC® 5LP: CY8C58LP Family Datasheet Figure 6-5. Power Mode Transitions 6.2.1.1 Active Mode Active mode is the primary operating mode of the device. When in active mode, the active configuration template bits control which available resources are enabled or disabled. When a resource is disabled, the digital clocks are gated, analog bias currents are disabled, and leakage currents are reduced as appropriate. User firmware can dynamically control subsystem power by setting and clearing bits in the active configuration template. The CPU can disable itself, in which case the CPU is automatically reenabled at the next wakeup event. When a wakeup event occurs, the global mode is always returned to active, and the CPU is automatically enabled, regardless of its template settings. Active mode is the default global power mode upon boot. 6.2.1.2 Alternate Active Mode Alternate Active mode is very similar to Active mode. In alternate active mode, fewer subsystems are enabled, to reduce power consumption. One possible configuration is to turn off the CPU and flash, and run peripherals at full speed. 6.2.1.3 Sleep Mode Sleep mode reduces power consumption when a resume time of 15 µs is acceptable. The wake time is used to ensure that the regulator outputs are stable enough to directly enter active mode. 6.2.1.4 Hibernate Mode In hibernate mode nearly all of the internal functions are disabled. Internal voltages are reduced to the minimal level to keep vital systems alive. Configuration state is preserved in hibernate mode and SRAM memory is retained. GPIOs configured as digital outputs maintain their previous values and external GPIO pin interrupt settings are preserved. The device can only return from hibernate mode in response to an external I/O interrupt. The resume time from hibernate mode is less than 100 µs. To achieve an extremely low current, the hibernate regulator has limited capacity. This limits the frequency of any signal present on the input pins; no GPIO should toggle at a rate greater than 10 kHz while in hibernate mode. If pins must be toggled at a high rate while in a low power mode, use sleep mode instead. 6.2.1.5 Wakeup Events Wakeup events are configurable and can come from an interrupt or device reset. A wakeup event restores the system to active mode. Firmware enabled interrupt sources include internally generated interrupts, power supervisor, central timewheel, and I/O interrupts. Internal interrupt sources can come from a variety of peripherals, such as analog comparators and UDBs. The central timewheel provides periodic interrupts to allow the system to wake up, poll peripherals, or perform real-time functions. Reset event sources include the external reset pin (XRES), WDT, and Precision Reset (PRES). 6.2.2 Boost Converter Applications that use a supply voltage of less than 1.71 V, such as solar panels or single cell battery supplies, may use the on-chip boost converter to generate a minimum of 1.8 V supply voltage. The boost converter may also be used in any system that requires a higher operating voltage than the supply provides such as driving 5.0 V LCD glass in a 3.3 V system. With the addition of an inductor, Schottky diode, and capacitors, it produces a selectable output voltage sourcing enough current to operate the PSoC and other on-board components. The boost converter accepts an input voltage VBAT from 0.5 V to 3.6 V, and can start up with VBAT as low as 0.5 V. The converter provides a user configurable output voltage of 1.8 to 5.0 V (VOUT) in 100 mV increments. VBAT is typically less than VOUT; if VBAT is greater than or equal to VOUT, then VOUT will be slightly less than VBAT due to resistive losses in the boost converter. The block can deliver up to 50 mA (IBOOST) depending on configuration to both the PSoC device and external components. The sum of all current sinks in the design including the PSoC device, PSoC I/O pin loads, and external component loads must be less than the IBOOST specified maximum current. Four pins are associated with the boost converter: VBAT, VSSB, VBOOST, and IND. The boosted output voltage is sensed at the VBOOST pin and must be connected directly to the chip’s supply inputs; VDDA, VDDD, and VDDIO if used to power the PSoC device. The boost converter requires four components in addition to those required in a non-boost design, as shown in Figure 6-6 on page 30. A 22 µF capacitor (CBAT) is required close to the VBAT pin to provide local bulk storage of the battery voltage and provide regulator stability. A diode between the battery and VBAT pin should not be used for reverse polarity protection because the diodes forward voltage drop reduces the VBAT voltage. Between the VBAT and IND pins, an inductor of 4.7 µH, 10 µH, or 22 µH is required. The inductor value can be optimized to increase the boost converter efficiency based on input voltage, output voltage, temperature, and current. Inductor size is determined by following the design guidance in this chapter and electrical specifications. The inductor must be placed within 1 cm of the VBAT and IND pins and have a minimum saturation current of 750 mA. Between the IND and VBOOST pins a Schottky diode must be placed within 1 cm of the pins. The Schottky diode shall have a forward current rating of at least 1.0 A and a reverse voltage of at least 20 V. A 22 µF bulk capacitor (CBOOST) must be connected close to VBOOST to provide regulator output stability. It is important to sum the total capacitance connected to the VBOOST pin and ensure the maximum CBOOST specification is not exceeded. All capacitors must be rated for a minimum of 10 V to minimize capacitive losses due to voltage de-rating. Active Manual Hibernate Alternate Active Sleep |
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