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CY8CKIT-059 数据表(PDF) 94 Page - Infineon Technologies AG |
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CY8CKIT-059 数据表(HTML) 94 Page - Infineon Technologies AG |
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94 / 140 page ![]() Document Number: 001-84932 Rev. *N Page 93 of 139 PSoC® 5LP: CY8C58LP Family Datasheet 11.5.3 Voltage Reference Figure 11-39. Vref vs Temperature Figure 11-40. Vref Long-term Drift Table 11-27. Voltage Reference Specifications See ADC external reference specifications in Delta-Sigma ADC on page 88. Parameter Description Conditions Min Typ Max Units VREF[50] Precision reference voltage Initial trimming, 25 °C 1.023 (–0.1%) 1.024 1.025 (+0.1%) V After typical PCB assembly, post reflow Typical (non-optimized) board layout and 250 °C solder reflow. Device may be calibrated after assembly to improve performance. –40 °C – ±0.5 – % 25 °C – ±0.2 – % 85 °C – ±0.2 – % 105 °C – ±0.3 – % Temperature drift[51] –– 30 ppm/°C Long term drift[51] – 100 – ppm/Khr Thermal cycling drift (stability)[51] – 100 – ppm 1024 1024.5 1025 1023 1023.5 1024 -40 -20 0 20 40 60 80 100 Temperature, °C 1.95V 1.8V 1.71V Notes 50. VREF is measured after packaging, and thus accounts for substrate and die attach stresses. 51. Based on device characterization (Not production tested). |
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