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CY8CKIT-059 数据表(PDF) 32 Page - Infineon Technologies AG |
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CY8CKIT-059 数据表(HTML) 32 Page - Infineon Technologies AG |
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32 / 140 page ![]() Document Number: 001-84932 Rev. *N Page 31 of 139 PSoC® 5LP: CY8C58LP Family Datasheet The switching frequency is set to 400 kHz using an oscillator integrated into the boost converter. The boost converter can be operated in two different modes: active and standby. Active mode is the normal mode of operation where the boost regulator actively generates a regulated output voltage. In standby mode, most boost functions are disabled, thus reducing power consumption of the boost circuit. Only minimal power is provided, typically < 5 µA to power the PSoC device in Sleep mode. The boost typically draws 250 µA in active mode and 25 µA in standby mode. The boost operating modes must be used in conjunction with chip power modes to minimize total power consumption. Table 6-4 lists the boost power modes available in different chip power modes. 6.2.2.1 Boost Firmware Requirements To ensure boost inrush current is within specification at startup, the Enable Fast IMO During Startup value must be unchecked in the PSoC Creator IDE. The Enable Fast IMO During Startup option is found in PSoC Creator in the design wide resources (cydwr) file System tab. Un-checking this option configures the device to run at 12 MHz vs 48 MHz during startup while configuring the device. The slower clock speed results in reduced current draw through the boost circuit. 6.2.2.2 Boost Design Process Correct operation of the boost converter requires specific component values determined for each designs unique operating conditions. The CBAT capacitor, Inductor, Schottky diode, and CBOOST capacitor components are required with the values specified in the electrical specifications, Table 11-7 on page 74. The only variable component value is the inductor LBOOST which is primarily sized for correct operation of the boost across operating conditions and secondarily for efficiency. Additional operating region constraints exist for VOUT, VBAT, IOUT, and TA. The following steps must be followed to determine boost converter operating parameters and LBOOST value. 1. Choose desired VBAT, VOUT, TA, and IOUT operating condition ranges for the application. 2. Determine if VBAT and VOUT ranges fit the boost operating range based on the TA range over VBAT and VOUT chart, Figure 11-8 on page 74. If the operating ranges are not met, modify the operating conditions or use an external boost regulator. 3. Determine if the desired ambient temperature (TA) range fits the ambient temperature operating range based on the TA range over VBAT and VOUT chart, Figure 11-8 on page 74. If the temperature range is not met, modify the operating condi- tions and return to step 2, or use an external boost regulator. 4. Determine if the desired output current (IOUT) range fits the output current operating range based on the IOUT range over VBAT and VOUT chart, Figure 11-9 on page 74. If the output current range is not met, modify the operating conditions and return to step 2, or use an external boost regulator. 5. Find the allowed inductor values based on the LBOOST values over VBAT and VOUT chart, Figure 11-10 on page 74. 6. Based on the allowed inductor values, inductor dimensions, inductor cost, boost efficiency, and VRIPPLE choose the optimum inductor value for the system. Boost efficiency and VRIPPLE typical values are provided in the Efficiency vs VBAT and VRIPPLE vs VBAT charts, Figure 11-11 on page 75 through Figure 11-14 on page 75. In general, if high efficiency and low VRIPPLE are most important, then the highest allowed inductor value should be used. If low inductor cost or small inductor size are most important, then one of the smaller allowed inductor values should be used. If the allowed inductor(s) efficiency, VRIPPLE, cost or dimensions are not acceptable for the application than an external boost regulator should be used. 6.3 Reset CY8C58LP has multiple internal and external reset sources available. The reset sources are: Power source monitoring - The analog and digital power voltages, VDDA, VDDD, VCCA, and VCCD are monitored in several different modes during power up, active mode, and sleep mode (buzzing). If any of the voltages goes outside predetermined ranges then a reset is generated. The monitors are programmable to generate an interrupt to the processor under certain conditions before reaching the reset thresholds. External - The device can be reset from an external source by pulling the reset pin (XRES) low. The XRES pin includes an internal pull-up to VDDIO1. VDDD, VDDA, and VDDIO1 must all have voltage applied before the part comes out of reset. Watchdog timer - A watchdog timer monitors the execution of instructions by the processor. If the watchdog timer is not reset by firmware within a certain period of time, the watchdog timer generates a reset. Software - The device can be reset under program control. Table 6-4. Chip and Boost Power Modes Compatibility Chip Power Modes Boost Power Modes Chip-active or alternate active mode Boost must be operated in its active mode. Chip-sleep mode Boost can be operated in either active or standby mode. In boost standby mode, the chip must wake up periodi- cally for boost active-mode refresh. Chip-hibernate mode Boost can be operated in its active mode. However, it is recommended not to use the boost in chip hibernate mode due to the higher current consumption in boost active mode. |
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