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CY8CKIT-059 数据表(PDF) 32 Page - Infineon Technologies AG

部件名 CY8CKIT-059
功能描述  Programmable System-on-Chip (PSoC®)
PDF  140 Pages
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制造商  INFINEON [Infineon Technologies AG]
网页  http://www.infineon.com
标志 INFINEON - Infineon Technologies AG

CY8CKIT-059 数据表(HTML) 32 Page - Infineon Technologies AG

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Document Number: 001-84932 Rev. *N
Page 31 of 139
PSoC® 5LP: CY8C58LP Family
Datasheet
The switching frequency is set to 400 kHz using an oscillator
integrated into the boost converter. The boost converter can be
operated in two different modes: active and standby. Active
mode is the normal mode of operation where the boost regulator
actively generates a regulated output voltage. In standby mode,
most boost functions are disabled, thus reducing power
consumption of the boost circuit. Only minimal power is provided,
typically < 5 µA to power the PSoC device in Sleep mode. The
boost typically draws 250 µA in active mode and 25 µA in
standby mode. The boost operating modes must be used in
conjunction with chip power modes to minimize total power
consumption. Table 6-4 lists the boost power modes available in
different chip power modes.
6.2.2.1 Boost Firmware Requirements
To ensure boost inrush current is within specification at startup,
the Enable Fast IMO During Startup value must be unchecked
in the PSoC Creator IDE. The Enable Fast IMO During Startup
option is found in PSoC Creator in the design wide resources
(cydwr) file System tab. Un-checking this option configures the
device to run at 12 MHz vs 48 MHz during startup while
configuring the device. The slower clock speed results in
reduced current draw through the boost circuit.
6.2.2.2 Boost Design Process
Correct operation of the boost converter requires specific
component values determined for each designs unique
operating conditions. The CBAT capacitor, Inductor, Schottky
diode, and CBOOST capacitor components are required with the
values specified in the electrical specifications, Table 11-7 on
page 74. The only variable component value is the inductor
LBOOST which is primarily sized for correct operation of the boost
across operating conditions and secondarily for efficiency.
Additional operating region constraints exist for VOUT, VBAT, IOUT,
and TA.
The following steps must be followed to determine boost
converter operating parameters and LBOOST value.
1. Choose desired VBAT, VOUT, TA, and IOUT operating condition
ranges for the application.
2. Determine if VBAT and VOUT ranges fit the boost operating
range based on the TA range over VBAT and VOUT chart,
Figure 11-8 on page 74. If the operating ranges are not met,
modify the operating conditions or use an external boost
regulator.
3. Determine if the desired ambient temperature (TA) range fits
the ambient temperature operating range based on the TA
range over VBAT and VOUT chart, Figure 11-8 on page 74. If
the temperature range is not met, modify the operating condi-
tions and return to step 2, or use an external boost regulator.
4. Determine if the desired output current (IOUT) range fits the
output current operating range based on the IOUT range over
VBAT and VOUT chart, Figure 11-9 on page 74. If the output
current range is not met, modify the operating conditions and
return to step 2, or use an external boost regulator.
5. Find the allowed inductor values based on the LBOOST values
over VBAT and VOUT chart, Figure 11-10 on page 74.
6. Based on the allowed inductor values, inductor dimensions,
inductor cost, boost efficiency, and VRIPPLE choose the
optimum inductor value for the system. Boost efficiency and
VRIPPLE typical values are provided in the Efficiency vs VBAT
and VRIPPLE vs VBAT charts, Figure 11-11 on page 75 through
Figure 11-14 on page 75. In general, if high efficiency and low
VRIPPLE are most important, then the highest allowed inductor
value should be used. If low inductor cost or small inductor
size are most important, then one of the smaller allowed
inductor values should be used. If the allowed inductor(s)
efficiency, VRIPPLE, cost or dimensions are not acceptable for
the application than an external boost regulator should be
used.
6.3 Reset
CY8C58LP has multiple internal and external reset sources
available. The reset sources are:
Power source monitoring - The analog and digital power
voltages, VDDA, VDDD, VCCA, and VCCD are monitored in
several different modes during power up, active mode, and
sleep mode (buzzing). If any of the voltages goes outside
predetermined ranges then a reset is generated. The monitors
are programmable to generate an interrupt to the processor
under certain conditions before reaching the reset thresholds.
External - The device can be reset from an external source by
pulling the reset pin (XRES) low. The XRES pin includes an
internal pull-up to VDDIO1. VDDD, VDDA, and VDDIO1 must
all have voltage applied before the part comes out of reset.
Watchdog timer - A watchdog timer monitors the execution of
instructions by the processor. If the watchdog timer is not reset
by firmware within a certain period of time, the watchdog timer
generates a reset.
Software - The device can be reset under program control.
Table 6-4. Chip and Boost Power Modes Compatibility
Chip Power Modes
Boost Power Modes
Chip-active or alternate
active mode
Boost must be operated in its active
mode.
Chip-sleep mode
Boost can be operated in either active
or standby mode. In boost standby
mode, the chip must wake up periodi-
cally for boost active-mode refresh.
Chip-hibernate mode
Boost can be operated in its active
mode. However, it is recommended not
to use the boost in chip hibernate mode
due to the higher current consumption
in boost active mode.



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