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CY8CKIT-059 数据表(PDF) 130 Page - Infineon Technologies AG |
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CY8CKIT-059 数据表(HTML) 130 Page - Infineon Technologies AG |
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130 / 140 page  Document Number: 001-84932 Rev. *N Page 129 of 139 PSoC® 5LP: CY8C58LP Family Datasheet 13. Packaging Table 13-1. Package Characteristics Parameter Description Conditions Min Typ Max Units TA Operating ambient temperature –40 25 105 °C TJ Operating junction temperature –40 – 120 °C TJA Package θJA (68-pin QFN) – 15 – °C/Watt TJA Package θJA (100-pin TQFP) – 34 – °C/Watt TJC Package θJC (68-pin QFN) – 13 – °C/Watt TJC Package θJC (100-pin TQFP) – 10 – °C/Watt TA Operating ambient temperature For CSP parts –40 25 85 °C TJ Operating junction temperature For CSP parts –40 – 100 °C TJA Package θJA (99-ball CSP) 16.5 °C/Watt TJc Package θJC (99-ball CSP) – 0.1 – °C/Watt Table 13-2. Solder Reflow Peak Temperature Package Maximum Peak Temperature Maximum Time at Peak Temperature 68-pin QFN 260 °C 30 seconds 100-pin TQFP 260 °C 30 seconds 99-ball WLCSP 255 °C 30 seconds Table 13-3. Package Moisture Sensitivity Level (MSL), IPC/JEDEC J-STD-2 Package MSL 68-pin QFN MSL 3 100-pin TQFP MSL 3 99-ball WLCSP MSL1 |
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