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TMS320F2811 数据表(PDF) 98 Page - Texas Instruments

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部件名 TMS320F2811
功能描述  Digital Signal Processors
PDF  173 Pages
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制造商  TI [Texas Instruments]
网页  http://www.ti.com
标志 TI - Texas Instruments

TMS320F2811 数据表(HTML) 98 Page - Texas Instruments

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Electrical Specifications
98
April 2001 − Revised July 2007
SPRS174O
EMU0
EMU1
TMS
TDI
TDO
TCK
VDDIO
DSP
EMU0
EMU1
TMS
TDI
TDO
TCK
TCK_RET
13
14
2
1
3
7
11
9
6 inches or less
PD
GND
GND
GND
GND
GND
5
4
6
8
10
12
JTAG Header
VDDIO
TRST
TRST
Figure 6−5. Emulator Connection Without Signal Buffering for the DSP
6.9
Power Sequencing Requirements
TMS320F2812/F2811/F2810 silicon requires dual voltages (1.8-V or 1.9-V and 3.3-V) to power up the CPU,
Flash, ROM, ADC, and the I/Os. To ensure the correct reset state for all modules during power up, there are
some requirements to be met while powering up/powering down the device. The current F2812 silicon
reference schematics (Spectrum Digital Incorporated eZdsp. board) suggests two options for the power
sequencing circuit.
Power sequencing is not needed for C281x devices. In other words, 3.3-V and 1.8-V (or 1.9-V) can ramp
together. C281x can also be used on boards that have F281x power sequencing implemented; however, if
the 1.8-V (or 1.9-V) rail lags the 3.3-V rail, the GPIO pins are undefined until the 1.8-V rail reaches at least
1 V.
•
Option 1:
In this approach, an external power sequencing circuit enables VDDIO first, then VDD and VDD1 (1.8 V or
1.9 V). After 1.8 V (or 1.9 V) ramps, the 3.3 V for Flash (VDD3VFL) and ADC (VDDA1/VDDA2/AVDDREFBG)
modules are ramped up. While option 1 is still valid, TI has simplified the requirement. Option 2 is the
recommended approach.
•
Option 2:
Enable power to all 3.3-V supply pins (VDDIO, VDD3VFL, VDDA1/VDDA2/VDDAIO/AVDDREFBG) and then
ramp 1.8 V (or 1.9 V) (VDD/VDD1) supply pins.
1.8 V or 1.9 V (VDD/VDD1) should not reach 0.3 V until VDDIO has reached 2.5 V. This ensures the reset
signal from the I/O pin has propagated through the I/O buffer to provide power-on reset to all the modules
inside the device. See Figure 6−11 for power-on reset timing.
•
Power-Down Sequencing:
During power-down, the device reset should be asserted low (8
µs, minimum) before the VDD supply
reaches 1.5 V. This will help to keep on-chip flash logic in reset prior to the VDDIO/VDD power supplies
ramping down. It is recommended that the device reset control from “Low-Dropout (LDO)” regulators or
voltage supervisors be used to meet this constraint. LDO regulators that facilitate power-sequencing (with
eZdsp is a trademark of Spectrum Digital Incorporated.



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