MCIMX503CVM8B datasheet(22/134 Pages) FREESCALE

22 / 134 page

i.MX50 Applications Processors for Consumer Products, Rev. 2

Freescale Semiconductor

Electrical Characteristics

4.1.2

Thermal Resistance Data

4.1.2.1

13 x 13 mm MAPBGA Package

Thermal Resistance Data

Table 8 provides thermal resistance data for a 13 x 13 mm MAPBGA package.

ESD damage immunity:

Vesd

Human Body Model (HBM)

Charge Device Model (CDM)

—

2000

500

Storage temperature range

TSTORAGE

–40

125

1 The term OVDD in this section refers to the associated supply rail of an input or output. The maximum range can be

superseded by the DC tables.

Table 8. 13 x 13 mm MAPBGA Package Thermal Resistance Data

Rating

Board

Symbol

Value

Unit

Junction to Ambient (natural convection)1, 2

1 Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board)

temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal

resistance.

2 Per JEDEC JESD51-2 with the single layer board horizontal. The thermal test board meets JESD51-9 specification.

Single layer board (1s)

RθJA

°C/W

Junction to Ambient (natural convection)1, 2, 3

3 Per JEDEC JESD51-6 with the board horizontal.

Four layer board (2s2p)

RθJA

°C/W

Junction to Ambient (at 200 ft/min)1, 3

Single layer board (1s)

RθJMA

°C/W

Junction to Ambient (at 200 ft/min)1, 3

Four layer board (2s2p)

RθJMA

°C/W

Junction to Board4

4 Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured on

the top surface of the board near the package.

—

RθJB

°C/W

Junction to Case5

5 Thermal resistance between the die and the case top surface as measured by using the cold plate method (MIL SPEC-883

Method 1012.1).

—

RθJC

9°C/W

Junction to Package Top (natural convection)6

6 Thermal characterization parameter indicating the temperature difference between the package top and the junction

temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter is written as

Psi-JT.

—

2°C/W

Table 7. Absolute Maximum Ratings (continued)

Parameter Description

Symbol

Min

Max

Unit

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