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MCIMX503CVM8B 数据表(PDF) 71 Page - Freescale Semiconductor, Inc |
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MCIMX503CVM8B 数据表(HTML) 71 Page - Freescale Semiconductor, Inc |
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71 / 134 page ![]() Electrical Characteristics i.MX50 Applications Processors for Consumer Products, Rev. 2 Freescale Semiconductor 71 NOTE The DDR15,16 could be adjusted by the parameter “DLL_WR_DELAY”; The ideal case is that SDQS is center aligned to the DRAM_D data valid window; For this table, HW_DRAM_PHY15[14:8] (DLL_WR_DELAY) = 0x10; 4.8.4 DRAM Data Input Timing DRAM Data input timing is defined for all DDR types: DDR2, LPDDR1, and LPDDR2. DDR16 CK >= 200 MHz DQ & DQM output hold time relative to DQS tDH 0.5 tCK - 1.3 —ns DDR15 CK < 200 MHz DQ & DQM output setup time relative to DQS tDS 1 — ns DDR16 CK < 200 MHz DQ & DQM output hold time relative to DQS tDH 1 — ns Table 47. DDR2 Input AC Timing ID Description Symbol Min Max Unit DDR20 Positive DQS latching edge to associated CK edge tDQSCK -0.5 tCK — ns Table 46. DDR Output AC Timing ID Description Symbol Min Max Unit Figure 31. DRAM Data Input Timing DRAM_SDCLK DRAM_SDCLK_B DRAM_SDQS DDR21 DDR22 d0 DDR20 d1 d2 d3 DRAM_D DRAM_SDQS_B |
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