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MCIMX503CVM8B 数据表(PDF) 1 Page - Freescale Semiconductor, Inc

部件名 MCIMX503CVM8B
功能描述  i.MX50 Applications Processors for Consumer Products
PDF  134 Pages
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制造商  FREESCALE [Freescale Semiconductor, Inc]
网页  http://www.freescale.com
标志 FREESCALE - Freescale Semiconductor, Inc

MCIMX503CVM8B 数据表(HTML) 1 Page - Freescale Semiconductor, Inc

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© 2012 Freescale Semiconductor, Inc. All rights reserved.
Freescale Semiconductor
Data Sheet: Technical Data
Document Number: IMX50CEC
Rev. 2, 05/2012
MCIMX50
Package Information
Plastic Package
Case 416 MAPBGA 13 x 13 mm, 0.5 mm pitch
Case 416 PoPBGA 13 x 13 mm, 0.5 mm pitch
Case 400 MAPBGA 17 x 17 mm, 0.8 mm pitch
Ordering Information
See Table 1 on page 7 for ordering information.
Freescale reserves the right to change the detail specifications as may be required to permit improvements
in the design of its products.
1
Introduction
The i.MX50 Applications Processors (i.MX50)
represent Freescale Semiconductor’s latest addition to a
growing family of multimedia-focused products,
offering high performance processing optimized for
lowest power consumption.
The i.MX50 is optimized for portable multimedia
applications and it features Freescale’s advanced
implementation of the ARM Cortex-A8™ core, which
operates at speed as high as 800 MHz. The i.MX50
provides a powerful display architecture, including a 2D
Graphics Processing Unit (GPU) and Pixel Processing
Pipeline (ePXP). In addition, i.MX508 includes a
complete integration of the electrophoretic display
function. The i.MX50 supports DDR2, LPDDR2, and
LPDDR1 DRAM at clock rate up to 266 MHz to enable
a range of performance and power trade-offs.
The flexibility of the i.MX50 architecture allows it to be
used in a variety of applications. As the heart of the
application chipset, the i.MX50 provides a rich set of
interfaces for connecting peripherals, such as WLAN,
Bluetooth™, GPS, and displays.
i.MX50 Applications
Processors for
Consumer Products
1.
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1.
Product Overview . . . . . . . . . . . . . . . . . . . . . . . . . . 2
1.2.
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.3.
Ordering Information . . . . . . . . . . . . . . . . . . . . . . . 7
1.4.
Part Number Feature Comparison . . . . . . . . . . . . . 7
1.5.
Package Feature Comparison . . . . . . . . . . . . . . . . 8
2.
Architectural Overview . . . . . . . . . . . . . . . . . . . . . . . . . . 10
2.1.
Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
3.
Modules List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
3.1.
Special Signal Considerations . . . . . . . . . . . . . . . 17
4.
Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 20
4.1.
Chip-Level Conditions . . . . . . . . . . . . . . . . . . . . . 21
4.2.
Supply Power-Up/Power-Down Requirements and
Restrictions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
4.3.
I/O DC Parameters . . . . . . . . . . . . . . . . . . . . . . . . 30
4.4.
Output Buffer Impedance Characteristics . . . . . . 36
4.5.
I/O AC Parameters . . . . . . . . . . . . . . . . . . . . . . . . 40
4.6.
System Modules Timing . . . . . . . . . . . . . . . . . . . . 47
4.7.
External Interface Module (EIM) . . . . . . . . . . . . . . 59
4.8.
DRAM Timing Parameters . . . . . . . . . . . . . . . . . . 67
4.9.
External Peripheral Interfaces . . . . . . . . . . . . . . . 72
5.
Package Information and Contact Assignments . . . . . 100
5.1.
13 x 13 mm, 0.5 mm Pitch, 416 Pin MAPBGA Package
Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100
5.2.
13 x 13 mm, 0.5 mm Pitch, 416 Pin PoPBGA Package
Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 108
5.3.
17 x 17 mm, 0.8 mm Pitch, 400 Pin MAPBGA Package
Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 115
5.4.
Signal Assignments . . . . . . . . . . . . . . . . . . . . . . 123
6.
Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 133


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