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MCIMX503CVM8B 数据表(PDF) 1 Page - Freescale Semiconductor, Inc |
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MCIMX503CVM8B 数据表(HTML) 1 Page - Freescale Semiconductor, Inc |
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1 / 134 page ![]() © 2012 Freescale Semiconductor, Inc. All rights reserved. Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX50CEC Rev. 2, 05/2012 MCIMX50 Package Information Plastic Package Case 416 MAPBGA 13 x 13 mm, 0.5 mm pitch Case 416 PoPBGA 13 x 13 mm, 0.5 mm pitch Case 400 MAPBGA 17 x 17 mm, 0.8 mm pitch Ordering Information See Table 1 on page 7 for ordering information. Freescale reserves the right to change the detail specifications as may be required to permit improvements in the design of its products. 1 Introduction The i.MX50 Applications Processors (i.MX50) represent Freescale Semiconductor’s latest addition to a growing family of multimedia-focused products, offering high performance processing optimized for lowest power consumption. The i.MX50 is optimized for portable multimedia applications and it features Freescale’s advanced implementation of the ARM Cortex-A8™ core, which operates at speed as high as 800 MHz. The i.MX50 provides a powerful display architecture, including a 2D Graphics Processing Unit (GPU) and Pixel Processing Pipeline (ePXP). In addition, i.MX508 includes a complete integration of the electrophoretic display function. The i.MX50 supports DDR2, LPDDR2, and LPDDR1 DRAM at clock rate up to 266 MHz to enable a range of performance and power trade-offs. The flexibility of the i.MX50 architecture allows it to be used in a variety of applications. As the heart of the application chipset, the i.MX50 provides a rich set of interfaces for connecting peripherals, such as WLAN, Bluetooth™, GPS, and displays. i.MX50 Applications Processors for Consumer Products 1. Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.1. Product Overview . . . . . . . . . . . . . . . . . . . . . . . . . . 2 1.2. Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 1.3. Ordering Information . . . . . . . . . . . . . . . . . . . . . . . 7 1.4. Part Number Feature Comparison . . . . . . . . . . . . . 7 1.5. Package Feature Comparison . . . . . . . . . . . . . . . . 8 2. Architectural Overview . . . . . . . . . . . . . . . . . . . . . . . . . . 10 2.1. Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 3. Modules List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 3.1. Special Signal Considerations . . . . . . . . . . . . . . . 17 4. Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 20 4.1. Chip-Level Conditions . . . . . . . . . . . . . . . . . . . . . 21 4.2. Supply Power-Up/Power-Down Requirements and Restrictions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 4.3. I/O DC Parameters . . . . . . . . . . . . . . . . . . . . . . . . 30 4.4. Output Buffer Impedance Characteristics . . . . . . 36 4.5. I/O AC Parameters . . . . . . . . . . . . . . . . . . . . . . . . 40 4.6. System Modules Timing . . . . . . . . . . . . . . . . . . . . 47 4.7. External Interface Module (EIM) . . . . . . . . . . . . . . 59 4.8. DRAM Timing Parameters . . . . . . . . . . . . . . . . . . 67 4.9. External Peripheral Interfaces . . . . . . . . . . . . . . . 72 5. Package Information and Contact Assignments . . . . . 100 5.1. 13 x 13 mm, 0.5 mm Pitch, 416 Pin MAPBGA Package Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100 5.2. 13 x 13 mm, 0.5 mm Pitch, 416 Pin PoPBGA Package Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 108 5.3. 17 x 17 mm, 0.8 mm Pitch, 400 Pin MAPBGA Package Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 115 5.4. Signal Assignments . . . . . . . . . . . . . . . . . . . . . . 123 6. Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 133 |
类似零件编号 - MCIMX503CVM8B |
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