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MCIMX503CVM8B 数据表(PDF) 69 Page - Freescale Semiconductor, Inc |
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MCIMX503CVM8B 数据表(HTML) 69 Page - Freescale Semiconductor, Inc |
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69 / 134 page  Electrical Characteristics i.MX50 Applications Processors for Consumer Products, Rev. 2 Freescale Semiconductor 69 4.8.2 DRAM Command and Address Output Timing—LPDDR2 The following diagrams and tables specify the timings related to the address and command pins, which interface LPDDR2 memory devices. Table 45. EMI Command/Address AC Timing ID Description Symbol Min Max Unit DDR1 CK cycle time tCK 3.75 — ns DDR2 CK high level width tCH 0.48 tCK 0.52 tCK ns DDR3 CK low level width tCL 0.48 tCK 0.52 tCK ns DDR4 Control output setup time tIS 0.5 tCK - 0.3 —ns DDR5 Control output hold time tIH 0.5 tCK - 0.3 —ns DDR6 CK >= 200 MHz Address output setup time tIS 0.5 tCK - 1.3 —ns DDR7 CK >= 200 MHz Address output hold time tIH 0.5 tCK - 1.3 —ns DDR6 CK < 200 MHz Address output setup time tIS 1 — ns DDR7 CK < 200 MHz Address output hold time tIH 1 — ns Figure 29. DRAM Command/Address Output Timing—LPDDR2 DRAM_SDCLK DRAM_SDCLK_B DRAM_CS0 DRAM_A[9:0] DDR1 DDR2 DDR3 DDR4 DDR5 rise fall DDR6 DDR7 |
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