MCIMX503CVM8B datasheet(9/134 Pages) FREESCALE

9 / 134 page

Introduction

i.MX50 Applications Processors for Consumer Products, Rev. 2

Freescale Semiconductor

416 PoPBGA

13 x 13 mm,

0.5 mm pitch

Deleted Pins:

DRAM_A10

DRAM_A11

DRAM_A12

DRAM_A13

DRAM_A14

DRAM_CAS

DRAM_OPEN

DRAM_OPENFB

DRAM_RAS

DRAM_SDBA0

DRAM_SDBA1

DRAM_SDBA2

DRAM_SDCLK_1

DRAM_SDCLK_1_B

DRAM_SDODT0

DRAM_SDODT1

DRAM_SDWE

DRAM_OPEN

DRAM_OPENFB

Added Pins:

POP_EMMC_RST

POP_LPDDR2_ZQ0

POP_LPDDR2_ZQ1

POP_LPDDR2_1.8V

POP_NAND_VCC

• The i.MX50 PoPBGA package supports 168-FBGA

LPDDR2 DRAM memory only. It is not possible to support

LPDDR1 or DDR2 on the i.MX50 PoPBGA.

• i.MX50 PoPBGA was designed to accommodate a

combined LPDDR2 / eMMC PoP memory. The PoP eMMC

device uses the SD3_DATA[7:0], SD3_CLK, and

SD3_CMD pins. Because the PoP eMMC I/O and memory

supplies are tied together on the substrate, 1.8 V eMMC

I/O operation is not supported for the PoP eMMC device.

POP_NAND_VCC and NVCC_NANDF must use a 3 V

supply.

• The NVCC_EMI_DRAM power pins supply 1.2 V power to

the i.MX50 DRAM controller as well as the PoP LPDDR2

DRAM.

• Additional PoP package pin descriptions may be found in

the Special Signals Considerations section (Table 5).

• On the PoPBGA package, the DRAM Address, Data, and

clock pins are routed to the bottom balls for Freescale test

purposes only. It is recommended that these bottom

DRAM pins are left unconnected on the customer PCB.

• USB_OTG_VDDA25 and USB_H1_VDDA25 are shorted

together on the 416 PoPBGA package substrate.

• USB_OTG_VDDA33 and USB_H1_VDDA33 are shorted

together on the 416 PoPBGA package substrate.

400 MAPBGA 17 x 17 mm,

0.8 mm pitch

Deleted Pins:

DRAM_SDCLK_1

DRAM_SDCLK_1_B

DRAM_A14

DRAM_SDODT1

UART2_CTS

UART2_RTS

• USB_OTG_VDDA25 and USB_H1_VDDA25 are

independent and NOT shorted together on the 400

MAPBGA package substrate.

• USB_OTG_VDDA33 and USB_H1_VDDA33 are

independent and NOT shorted together on the 400

MAPBGA package substrate.

Table 3. Package Feature Comparison (continued)

Package

Dimensions

I/O Pin Differences

Versus 416 MAPBGA

Notes on Package Differences

MCIMX503CVM8B 数据表(PDF) 9 Page - Freescale Semiconductor, Inc

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