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TNETV2840ENGGU 数据表(PDF) 86 Page - Texas Instruments |
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TNETV2840ENGGU 数据表(HTML) 86 Page - Texas Instruments |
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86 / 91 page  PACKAGE OPTION ADDENDUM www.ti.com 13-Oct-2015 Addendum-Page 1 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/Ball Finish (6) MSL Peak Temp (3) Op Temp (°C) Device Marking (4/5) Samples TMS320VC5441AGGU ACTIVE BGA MICROSTAR GGU 169 160 TBD SNPB Level-3-220C-168 HR -40 to 100 DVC5441AGGU TMS320VC5441APGF ACTIVE LQFP PGF 176 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 100 320VC5441APGF TMS TMS320VC5441AZGU ACTIVE BGA MICROSTAR ZGU 169 160 Green (RoHS & no Sb/Br) SNAGCU Level-3-260C-168 HR -40 to 100 DVC5441AZGU TMS320VC5441GGU ACTIVE BGA MICROSTAR GGU 169 160 TBD SNPB Level-3-220C-168 HR 0 to 85 DVC5441GGU TMS320VC5441PGF ACTIVE LQFP PGF 176 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 85 320VC5441PGF TMS TMS320VC5441ZGU ACTIVE BGA MICROSTAR ZGU 169 160 Green (RoHS & no Sb/Br) SNAGCU Level-3-260C-168 HR 0 to 85 DVC5441ZGU TNETV2840ENGGU ACTIVE BGA MICROSTAR GGU 169 TBD SNPB Level-3-220C-168 HR 0 to 85 DVC5441GGU (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. |
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