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TNETV6446AINZWT 数据表(PDF) 57 Page - Texas Instruments |
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TNETV6446AINZWT 数据表(HTML) 57 Page - Texas Instruments |
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57 / 227 page ![]() DM644x DMSoC: DM6443 DM6446 PREFIX DEVICE SPEED RANGE TMS 320 DM6446 ZWT ( ) TMX = Experimental device TMS = Qualified device DEVICE FAMILY 320 = TMS320 ™DSP family PACKAGE TYPE(A) ZWT = 361-pin plastic BGA, with Pb-free soldered balls DEVICE(B) TEMPERATURE RANGE (DEFAULT: 0 C TO 85 C) ° ° ( ) Blank = 0 C to 85 C, commercial temperature ° ° A = -40 C to 105 C, extended temperature ° ° Blank = 594-MHz DSP, 297-MHZ ARM9, commercial temperature Blank = 513-MHz DSP, 256.5-MHZ ARM9, extended temperature A. BGA = Ball Grid Array B. For actual device part numbers (P/Ns) and ordering information, see the TI website (http://www.ti.com). ( ) SILICON REVISION Blank = Silicon 1.3 A = Silicon 2.1 8 = 810-MHz DSP, 405-MHZ ARM9, commercial temperature B = Silicon 2.3 TMS320DM6446 www.ti.com SPRS283H – DECEMBER 2005 – REVISED SEPTEMBER 2010 Predictions show that prototype devices (TMX or TMP) have a greater failure rate than the standard production devices. Texas Instruments recommends that these devices not be used in any production system because their expected end-use failure rate still is undefined. Only qualified production devices are to be used. TI device nomenclature also includes a suffix with the device family name. This suffix indicates the package type (for example, ZWT), the temperature range (for example, "Blank" is the commercial temperature range), and the device speed range in megahertz (for example, "Blank" is the default [594-MHz DSP, 297-MHz ARM9]). Figure 2-6 provides a legend for reading the complete device name for any TMS320DM644x SoC platform member. Figure 2-6. Device Nomenclature Copyright © 2005–2010, Texas Instruments Incorporated Device Overview 57 Submit Documentation Feedback Product Folder Link(s): TMS320DM6446 |
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