ST7LITE49K2 datasheet(243/245 Pages) STMICROELECTRONICS

243 / 245 page

ST7LITE49K2

Package mechanical data

243/245

15.1

Thermal characteristics

1.00

0.0394

Number of pins

N32

Values in inches are converted from mm and rounded to 4 decimal digits.

Table 113.

32-pin low profile quad flat package (7x7), package mechanical data

Dim.

inches(1)

Min

Typ

Max

Min

Typ

Max

Table 114.

Thermal characteristics

Symbol

Ratings

Value

Unit

RthJA

Package thermal resistance

(junction to ambient)

LQFP32

SDIP32

°C/W

TJmax

Maximum junction

temperature(1)

The maximum chip-junction temperature is based on technology characteristics.

150

°C

PDmax

Power dissipation(2)

The maximum power dissipation is obtained from the formula PD = (TJ -TA) / RthJA.

The power dissipation of an application can be defined by the user with the formula: PD=PINT+PPORT

where PINT is the chip internal power (IDDxVDD) and PPORT is the port power dissipation depending on the

ports used in the application.

160

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