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ST10F280 数据表(PDF) 132 Page - STMicroelectronics |
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ST10F280 数据表(HTML) 132 Page - STMicroelectronics |
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132 / 186 page ![]() 132/186 ST10F280 When enabled, the open drain of the RSTIN pin is activated, pulling down the reset signal, for the duration of the internal reset sequence (synchronous/asynchronous hardware, software and watchdog timer resets). At the end of the internal reset sequence the pull down is released and the RSTIN pin is sampled 8 TCL periods later. – If signal is sampled low, a hardware reset is trig- gered again. – If it is sampled high, the chip exits reset state ac- cording to the running reset way (synchronous/ asynchronous hardware, software and watch- dog timer resets ). Note: The bidirectional reset function is disabled by any reset sequence (Bit BDRSTEN of SYSCON is cleared). To be activated again it must be enabled during the initialization routine. 17.6 - Reset Circuitry The internal reset circuitry is described in Figure 68. An internal pull-up resistor is implemented on RSTIN pin. (50k Ω minimum, to 250kΩ maximum). The minimum reset time must be calculated using the lowest value. In addition, a programmable pull-down (bit BDRSTEN of SYSCON register) drives the RSTIN pin according to the internal reset state as explained in Section 17.5 - RSTOUT Pin and Bidirectional Reset. The RSTOUT pin provides a signals to the application as described in Section 17.5 - RSTOUT Pin and Bidirectional Reset. A weak internal pull-down is connected to the RPD pin to discharge external capacitor to Vss at a rate of 100 µA to 200µA. This Pull-down is turned on when RSTIN pin is low If bit PWDCFG of SYSCON register is set, an internal pull-up resistor is activated at the end of the reset sequence. This pull-up charges the capacitor connected to RPD pin. If Bidirectional Reset function is not used, the simplest way to reset ST10F280 is to connect external components as shown in Figure 69. It works with reset from application (hardware or manual) and with power-on. The value of C1 capacitor, connected on RSTIN pin with internal pull-up resistor (50k Ω to 250kΩ), must lead to a charging time long enough to let the internal or external oscillator and / or the on-chip PLL to stabilize. The R0-C0 components on RPD pin are mainly implemented to provide a time delay to exit Power down mode (see Chapter 18 - Power Reduction Modes). Nervertheless, they drive RPD pin level during resets and they lead to different reset modes as explained hereafter. On power-on, C0 is totaly discharged, a low level on RPD pin forces an asynchronous hardware reset. C0 capacitor starts to charge throught R0 and at the end of reset sequence ST10F280 restarts. RPD pin threshold is typically 2.5V. Depending on the delay of the next applied reset, the MCU can enter a synchronous reset or an asynchronous reset. If RPD pin is below 2.5V an asynchronous reset starts, if RPD pin is above 2.5V a synchronous reset starts. (see Section 17.1 - Asynchronous Reset (Long Hardware Reset) and Section 17.2 - Synchronous Reset (Warm Reset)). Note that an internal pull-down is connected to RPD pin and can drive a 100 µA to 200µA current. This Pull-down is turned on when RSTIN pin is low. In order to properly use the Bidirectional reset features, the schematic (or equivalent) of Figure 70 must be implemented. R1-C1 only work for power-on or manual reset in the same way as explained previously. D1 diode brings a faster discharge of C1 capacitor at power-off during repetitive switch-on / switch-off sequences. D2 diode performs an OR-wired connection, it can be replaced with an open drain buffer. R2 resistor may be added to increase the pull-up current to the open drain in order to get a faster rise time on RSTIN pin when bidirectional function is activated. The start-up configurations and some system features are selected on reset sequences as described in Table 33 and Table 34. Table 33 describes what is the system configuration latched on PORT0 in the five different reset ways. Table 34 summarizes the bit state of PORT0 latched in RP0H, SYSCON, BUSCON0 registers. RPOH register is described in Section 19.2 - System Configuration Registers. |
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