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LSM6DSV 数据表(PDF) 44 Page - STMicroelectronics |
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LSM6DSV 数据表(HTML) 44 Page - STMicroelectronics |
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44 / 187 page  7 Application hints 7.1 LSM6DSV electrical connections in mode 1 Figure 27. LSM6DSV electrical connections in mode 1 GND or Vdd_IO Vdd_IO GND 100 nF C2 SDO/SA0 SDx SCx INT1 11 5 7 12 TOP VIEW Vdd INT2 NC NC 14 8 4 Vdd GND 100 nF C1 1 SCL SDA Vdd_IO Rpu Rpu Pull-up to be added Rpu=10kOhm I2C configuration HOST LSM6DSV Mode 1 (1) (1) I2C SPI (3/4-w) / MIPI I3C / ® 1. Leave pin electrically unconnected and soldered to PCB. The device core is supplied through the Vdd line. Power supply decoupling capacitors (C1, C2 = 100 nF ceramic) should be placed as near as possible to the supply pin of the device (common design practice). The functionality of the device and the measured acceleration/angular rate data is selectable and accessible through the SPI/I²C/MIPI I3C® interface. The functions, the threshold and the timing of the two interrupt pins for each sensor can be completely programmed by the user through the SPI/I²C/MIPI I3C® interface. LSM6DSV Application hints DS13476 - Rev 2 page 44/187 |
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