LSM6DSV datasheet(46/187 Pages) STMICROELECTRONICS

46 / 187 page

7.3

LSM6DSV electrical connections in mode 3

Figure 29. LSM6DSV electrical connections in mode 3 (auxiliary 3/4-wire SPI)

Vdd_IO

GND

100 nF

SDO

INT1

TOP

VIEW

Vdd

INT2

Vdd

GND

100 nF

SDI_Aux

SPC_Aux

OCS_Aux

SCL

SDA

Vdd_IO

Rpu

Pull-up to be added

Rpu=10kOhm

I2C configuration

(1)

HOST

Camera

module

Mode 3

For XL and/or

gyro data

I2C

SPI (3/4-w)

MIPI I3C

Aux SPI (3/4-wire)

LSM6DSV

Leave pin electrically unconnected and soldered to PCB.

Note:

When mode 3 is used, the pull-up on pins 10 and 11 can be disabled (refer to Table 21. Internal pin status). To

avoid leakage current, it is recommended to not leave the SPI lines floating (also when the OIS system is off).

The device core is supplied through the Vdd line. Power supply decoupling capacitors (C1, C2 = 100 nF ceramic)

should be placed as near as possible to the supply pin of the device (common design practice).

The functionality of the device is selectable and accessible through the SPI/I²C/MIPI I3C® primary interface.

Measured acceleration/angular rate data is selectable and accessible through the SPI/I²C/MIPI I3C® primary

interface and auxiliary SPI.

The functions, the threshold and the timing of the two interrupt pins for each sensor can be completely

programmed by the user through the SPI/I²C/MIPI I3C® interface.

LSM6DSV

LSM6DSV electrical connections in mode 3

DS13476 - Rev 2

page 46/187

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