LSM6DSV datasheet(2/187 Pages) STMICROELECTRONICS

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Overview

The LSM6DSV is a system-in-package featuring a high-performance 3-axis digital accelerometer and 3-axis

digital gyroscope.

The LSM6DSV delivers best-in-class motion sensing that can detect orientation and gestures in order to empower

application developers and consumers with features and capabilities that are more sophisticated than simply

orienting their devices to portrait and landscape mode.

The event-detection interrupts enable efficient and reliable motion tracking and contextual awareness,

implementing hardware recognition of free-fall events, 6D orientation, click and double-click sensing, activity

or inactivity, stationary/motion detection and wake-up events. Finite state machine processing allows moving

some algorithms from the application processor to the LSM6DSV sensor, enabling consistent reduction of power

consumption.

The LSM6DSV supports main OS requirements, offering real, virtual, and batch mode sensors. In addition, the

LSM6DSV can efficiently run the sensor-related features specified in Android, saving power and enabling faster

reaction time. In particular, the LSM6DSV has been designed to implement hardware features such as significant

motion detection, stationary/motion detection, tilt, pedometer functions, timestamping and to support the data

acquisition of external sensors.

The LSM6DSV offers hardware flexibility to connect the pins with different mode connections to external sensors

to expand functionalities such as adding a sensor hub, auxiliary SPI, and so forth.

The LSM6DSV offers advanced design flexibility for OIS and EIS applications. Both channels have a dedicated

processing path with independent filtering and enhanced EIS channel gyroscope data are read over the primary

interfaces I²C/ MIPI I3C® v1.1 / SPI.

Core 1 has been designed for user-interface data processing for motion tracking. Data are available on the

primary output of I²C / SPI / I3C® for the accelerometer and gyroscope with independent ODR and FS.

Core 2 has been designed for OIS applications. Data are available on the aux SPI at 7.68 kHz with

accelerometer/gyroscope processing with independent FS at ±2 g - ±16 g (accelerometer) / ±125 dps - ±2000

dps (gyroscope). The accelerometer is also available as standalone with dedicated filtering.

Core 3 has been design for enhanced EIS. Data are available in freerun mode in the output registers or in FIFO

with dedicated tag and timestamp.

Up to 4.5 KB of FIFO with compression and dynamic allocation of significant data (that is, external sensors,

timestamp, and so forth) allows overall power saving of the system.

Like the entire portfolio of MEMS sensor modules, the LSM6DSV leverages the robust and mature in-house

manufacturing processes already used for the production of micromachined accelerometers and gyroscopes. The

various sensing elements are manufactured using specialized micromachining processes, while the IC interfaces

are developed using CMOS technology that allows the design of a dedicated circuit, which is trimmed to better

match the characteristics of the sensing element.

The LSM6DSV embeds advanced dedicated features like a finite state machine and data filtering for OIS, EIS,

and motion processing.

The LSM6DSV is available in a small plastic land grid array (LGA) package of 2.5 x 3.0 x 0.83 mm to address

ultra-compact solutions.

LSM6DSV

Overview

DS13476 - Rev 2

page 2/187

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