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ST10F296 数据表(PDF) 294 Page - STMicroelectronics |
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ST10F296 数据表(HTML) 294 Page - STMicroelectronics |
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294 / 346 page ![]() Obsolete Product(s) - Obsolete Product(s) Electrical characteristics ST10F296E 294/346 Solving Equation 22 and Equation 23 gives Equation 24: Equation 24 Where: K is a constant for the particular part, which may be determined from Equation 24 by measuring PD (at equilibrium) for a known TA. Using this value of K, the values of PD and TJ may be obtained by solving Equation 22 and Equation 23 iteratively for any value of TA. Based on thermal characteristics of the package and with reference to the power consumption values provided in Table 163: DC characteristics and Figure 97: Supply current versus the operating frequency (run and idle modes)), the product classification in Table 162 is suggested. The exact power consumption of the device inside the application must be computed according to different working conditions, thermal profiles, real thermal resistance of the system (including the printed circuit board or other substrata), I/O activity, and so on. 24.4 Parameter interpretation The parameters listed in Table 163: DC characteristics represent characteristics of the ST10F296E and its demands on the system. Where the ST10F296E logic provides signals with their respective timing characteristics, the symbol for controller characteristics (CC) is included in the ‘Symbol’ column. Where the external system must provide signals with their respective timing characteristics to the ST10F296E, the symbol for system requirement (SR) is included in the ‘Symbol’ column. Table 161. Thermal characteristics Symbol Description Value (typical) Unit ΘJA Thermal resistance junction-ambient PBGA 208 package (23 x 23 x 1.96 mm) 30 ° C/W Table 162. Package characteristics Package Ambient temperature range CPU frequency range PBGA 208 -40 to 125 °C 1 to 64 MHz KP D T A 273 ° C + () Θ JA + × P D 2 × = Obsolete Product(s) - Obsolete Product(s) |
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