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ST10F296 数据表(PDF) 342 Page - STMicroelectronics |
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ST10F296 数据表(HTML) 342 Page - STMicroelectronics |
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342 / 346 page ![]() Obsolete Product(s) - Obsolete Product(s) Package mechanical data ST10F296E 342/346 25 Package mechanical data To meet environmental requirements, ST offers the device in ECOPACK® packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK® specifications are available at www.st.com.. Figure 121. PBGA 208 (23 x 23 x 1.96 mm) outline 1. PBGA stands for plastic ball grid array. 2. The terminal A1 corner of the package must be identified on the top surface by using a corner chamfer, ink or metallized marking, identation or other feature of the package body or an integral heastslug. A distinguishing feature is also allowable on the bottom of the package to identify the terminal A1 corner. The exact shape and size of this feature is optional. A1 E1 φ b (208 + 25 balls) U T R P N M L K 10 11 12 13 14 15 16 17 6789 J G F H E D B A C 45 12 3 A1 ball pad corner 2 f E e e D1 D f A2 A3 C Seating plane A Obsolete Product(s) - Obsolete Product(s) |
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