ADP1050ACPZ-R7 datasheet(9/93 Pages) AD

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ADP1050

Data Sheet

ABSOLUTE MAXIMUM RATINGS

Table 2.

Parameter

Rating

Supply Voltage (Continuous) VDD

4.2 V

Digital Pins (OUTA, OUTB, SR1, SR2, PG/ALT,

SDA, SCL) to AGND

−0.3 V to VDD + 0.3 V

VS−, VS+, VF, OVP, RTD, ADD, CS1 to AGND

−0.3 V to VDD + 0.3 V

SYNI/FLGI, CTRL

−0.3 V to VDD + 0.3 V

Operating Temperature Range (TA)

−40°C to +125°C

Storage Temperature Range

−65°C to +150°C

Junction Temperature

150°C

Peak Solder Reflow Temperature

SnPb Assemblies (10 sec to 30 sec)

240°C

RoHS-Compliant Assemblies (20 sec to

40 sec)

260°C

ESD Charged Device Model

1.25 kV

ESD Human Body Model

5.0 kV

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This is a

stress rating only; functional operation of the product at these

or any other conditions above those indicated in the operational

section of this specification is not implied. Operation beyond

the maximum operating conditions for extended periods may

affect product reliability.

THERMAL RESISTANCE

θJA is specified for the worst-case conditions, that is, a device

soldered in a circuit board for surface-mount packages.

Table 3. Thermal Resistance

Package Type

θJA

θJC

Unit

20-Lead LFCSP

37.05

1.53

°C/W

SOLDERING

It is important to follow the correct guidelines when laying out

the printed circuit board (PCB) footprint for the ADP1050 and

for soldering the device onto the PCB. For detailed information

about these guidelines, see the AN-772 Application Note, A Design

and Manufacturing Guide for the Lead Frame Chip Scale Package

(LFCSP).

ESD CAUTION

Rev. A | Page 8 of 92

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