ADP1050ACPZ-R7 datasheet(93/93 Pages) AD

93 / 93 page

ADP1050

Data Sheet

OUTLINE DIMENSIONS

0.50

BSC

0.50

0.40

0.30

0.25

0.20

COMPLIANT

TO JEDEC STANDARDS MO-220-WGGD.

BOTTOM VIEW

TOP VIEW

EXPOSED

PAD

PIN 1

INDICATOR

4.10

4.00 SQ

3.90

SEATING

PLANE

0.80

0.75

0.70

0.05 MAX

0.02 NOM

0.20 REF

0.25 MIN

COPLANARITY

0.08

PIN 1

INDICATOR

2.65

2.50 SQ

2.35

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

Figure 59. 20-Lead Lead Frame Chip Scale Package [LFCSP_WQ]

4 mm × 4 mm Body, Very Very Thin Quad

(CP-20-10)

Dimensions shown in millimeters

ORDERING GUIDE

Model1

Temperature Range

Package Description

Package Option

ADP1050ACPZ-RL

−40°C to +125°C

20-Lead Lead Frame Chip Scale Package [LFCSP_WQ]

CP-20-10

ADP1050ACPZ-R7

−40°C to +125°C

20-Lead Lead Frame Chip Scale Package [LFCSP_WQ]

CP-20-10

ADP1051-240-EVALZ

240 W Evaluation Board for the ADP1051 and the ADP1050

ADP1050DC1-EVALZ

ADP1050 Daughter Card

ADP-I2C-USB-Z

USB to I2C Adapter

Z = RoHS Compliant Part.

I2C refers to a communications protocol originally developed by Philips Semiconductors (now NXP Semiconductors).

registered trademarks are the property of their respective owners.

D12039-0-6/14(A)

Rev. A | Page 92 of 92

ADP1050ACPZ-R7 数据表(PDF) 93 Page - Analog Devices

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