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ST7DALIF2 数据表(PDF) 160 Page - STMicroelectronics |
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ST7DALIF2 数据表(HTML) 160 Page - STMicroelectronics |
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160 / 171 page  Package characteristics ST7DALIF2 160/171 Table 94. Thermal characteristics Symbol Ratings Value Unit RthJA Package thermal resistance SO20 (junction to ambient) DIP20 125 63 °C/W TJmax Maximum junction temperature (1) 1. The maximum chip-junction temperature is based on technology characteristics. 150 °C PDmax Power dissipation (2) 2. The maximum power dissipation is obtained from the formula PD = (TJ -TA) / RthJA. The power dissipation of an application can be defined by the user with the formula: PD=PINT+PPORT where PINT is the chip internal power (IDDxVDD) and PPORT is the port power dissipation depending on the ports used in the application. 500 mW |
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