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H8SX1663 数据表(PDF) 13 Page - Renesas Technology Corp |
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H8SX1663 数据表(HTML) 13 Page - Renesas Technology Corp |
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13 / 1158 page ![]() Rev.1.00 Jun. 07, 2006 Page xiii of lii 6.6.6 Extension of Chip Select ( CS) Assertion Period................................................... 202 6.6.7 DACK Signal Output Timing ............................................................................... 204 6.7 Byte Control SRAM Interface ........................................................................................... 205 6.7.1 Byte Control SRAM Space Setting....................................................................... 205 6.7.2 Data Bus................................................................................................................ 205 6.7.3 I/O Pins Used for Byte Control SRAM Interface ................................................. 206 6.7.4 Basic Timing......................................................................................................... 207 6.7.5 Wait Control ......................................................................................................... 209 6.7.6 Read Strobe ( RD).................................................................................................. 211 6.7.7 Extension of Chip Select ( CS) Assertion Period................................................... 211 6.7.8 DACK Signal Output Timing ............................................................................... 211 6.8 Burst ROM Interface.......................................................................................................... 213 6.8.1 Burst ROM Space Setting ..................................................................................... 213 6.8.2 Data Bus................................................................................................................ 213 6.8.3 I/O Pins Used for Burst ROM Interface................................................................ 214 6.8.4 Basic Timing......................................................................................................... 215 6.8.5 Wait Control ......................................................................................................... 217 6.8.6 Read Strobe ( RD) Timing..................................................................................... 217 6.8.7 Extension of Chip Select ( CS) Assertion Period................................................... 217 6.9 Address/Data Multiplexed I/O Interface ............................................................................ 218 6.9.1 Address/Data Multiplexed I/O Space Setting ....................................................... 218 6.9.2 Address/Data Multiplex ........................................................................................ 218 6.9.3 Data Bus................................................................................................................ 218 6.9.4 I/O Pins Used for Address/Data Multiplexed I/O Interface .................................. 219 6.9.5 Basic Timing......................................................................................................... 220 6.9.6 Address Cycle Control.......................................................................................... 222 6.9.7 Wait Control ......................................................................................................... 223 6.9.8 Read Strobe ( RD) Timing.................................................................................... 223 6.9.9 Extension of Chip Select ( CS) Assertion Period................................................... 225 6.9.10 DACK Signal Output Timing ............................................................................... 227 6.10 DRAM Interface ................................................................................................................ 228 6.10.1 Setting DRAM Space............................................................................................ 228 6.10.2 Address Multiplexing............................................................................................ 228 6.10.3 Data Bus................................................................................................................ 229 6.10.4 I/O Pins Used for DRAM Interface ...................................................................... 229 6.10.5 Basic Timing......................................................................................................... 230 6.10.6 Controlling Column Address Output Cycle.......................................................... 231 6.10.7 Controlling Row Address Output Cycle ............................................................... 232 6.10.8 Controlling Precharge Cycle................................................................................. 234 6.10.9 Wait Control ......................................................................................................... 235 |
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