DRA821U4...ALM datasheet(244/252 Pages) TI

244 / 252 page

10.3 Documentation Support

To receive notification of documentation updates, navigate to the device product folder on ti.com. Click on

Subscribe to updates to register and receive a weekly digest of any product information that has changed. For

change details, review the revision history included in any revised document.

The following documents describe the DRA821 devices.

Technical Reference Manual

J7200 DRA821 Processor Silicon Revision 1.0 Texas Instruments Families of Products Technical

Reference Manual Details the integration, the environment, the functional description, and the programming

models for each peripheral and subsystem in the DRA821 family of devices.

Errata

J7200 DRA821 Processor Silicon Revision 1.0 Silicon Errata Describes the known exceptions to the

functional specifications for the device.

10.4 Support Resources

TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight

from the experts. Search existing answers or ask your own question to get the quick design help you need.

Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do

not necessarily reflect TI's views; see TI's Terms of Use.

10.5 Trademarks

I2C™ is a trademark of NXP Semiconductors.

eMMC™ is a trademark of MultiMediaCard Association.

Xccela™ is a trademark of Micron Technology, Ink.

HyperBus™ is a trademark of Mobiveil Inc.

Jacinto™, Code Composer Studio™, and TI E2E™ are trademarks of Texas Instruments.

CoreSight™ is a trademark of Arm Limited (or its subsidiaries) in the US and/or elsewhere.

Arm® and Cortex®, and are registered trademarks of Arm Limited (or its subsidiaries) in the US and/or

elsewhere.

PCI-Express® is a registered trademark of PCI-SIG.

I3C® is a registered trademark of MIPI Alliance, Inc.

Secure Digital® is a registered trademark of SD Card Association.

All trademarks are the property of their respective owners.

10.6 Electrostatic Discharge Caution

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled

with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may

be more susceptible to damage because very small parametric changes could cause the device not to meet its published

specifications.

10.7 Glossary

TI Glossary

This glossary lists and explains terms, acronyms, and definitions.

DRA821U-Q1

SPRSP57D – APRIL 2020 – REVISED DECEMBER 2022

www.ti.com

244

Submit Document Feedback

Product Folder Links: DRA821U-Q1

DRA821U4...ALM 数据表(PDF) 244 Page - Texas Instruments

DRA821U4...ALM 数据表(HTML) 244 Page - Texas Instruments

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 ...More

数据表下载