WM8944BECSSLASHR datasheet(163/165 Pages) CIRRUS

163 / 165 page

WM8944B

Rev 4.3

163

PACKAGE DIMENSIONS

DM080.B

B: 25 BALL W-CSP PACKAGE 2.410 X 2.410 X 0.546mm BODY, 0.50 mm BALL PITCH

CORNER

TOP VIEW

0.10

2 X

0.10

2 X

DETAIL 1

NOTES:

1. PRIMARY DATUM -Z- AND SEATING PLANE ARE DEFINED BY THE SPHERICAL CROWNS OF THE SOLDER BALLS.

2. THIS DIMENSION INCLUDES STAND-

OFF HEIGHT ‘A1’ AND BACKSIDE COATING.

3. A1 CORNER IS IDENTIFIED BY INK/LASER MARK ON TOP PACKAGE.

4. BILATERAL TOLERANCE ZONE IS APPLIED TO EACH SIDE OF THE PACKAGE BODY.

‘e’ REPRESENTS THE BASIC SOLDER BALL GRID PITCH.

6. THIS DRAWING IS SUBJECT TO CHANGE WITHOUT NOTICE.

7. FOLLOWS JEDEC DESIGN GUIDE MO-211-C.

0.207

2.00 BSC

2.410

0.205 BSC

2.00 BSC

0.500 BSC

2.410

Dimensions (mm)

Symbols

MIN

NOM

MAX

NOTE

0.546

0.265

0.280

0.295

0.586

0.506

0.244

0.281

0.022

0.019

0.025

Bump centre to

die edge

BOTTOM VIEW

0.205 BSC

2.380

2.440

0.264

0.364

0.314

Bump centre to

die edge

DETAIL 1

SOLDER BALL

WM8944BECS/R 数据表(PDF) 163 Page - Cirrus Logic

WM8944BECS/R 数据表(HTML) 163 Page - Cirrus Logic

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