HC705JB2GRSSLASHH datasheet(119/128 Pages) NXP

119 / 128 page

August 28, 1998

GENERAL RELEASE SPECIFICATION

ELECTRICAL SPECIFICATIONS

REV 1.1

13-1

SECTION 13

ELECTRICAL SPECIFICATIONS

13.1

MAXIMUM RATINGS

This device contains circuitry to protect the inputs against damage due to high

static voltages or electric ﬁelds; however, it is advised that normal precautions be

taken to avoid application of any voltage higher than maximum-rated voltages to

this high-impedance circuit. For proper operation, it is recommended that VIN and

VOUT be constrained to the range VSS ≤ (VIN or VOUT) ≤ VDD. Reliability of

operation is enhanced if unused inputs are connected to an appropriate logic

voltage level (e.g., either VSS or VDD).

13.2

THERMAL CHARACTERISTICS

Table 13-1. Maximum Ratings

(Voltages referenced to VSS)

Rating

Symbol

Value

Unit

Supply Voltage

VDD

–0.3 to +7.0

Input Voltage

VIN

VSS–0.3 to VDD+0.3

EPROM Programming Voltage

VPP

Current Drain Per Pin Excluding PB1, PB2, VDD and VSS

–25

Operating Temperature Range

(Standard)

(Extended)

TL to TH

0 to +70

–40 to +85

°C

Storage Temperature Range

TSTG

–65 to +150

°C

Table 13-2. Thermal Characteristics

Characteristic

Symbol

Value

Unit

Thermal Resistance

20-Pin PDIP

20-Pin SOIC

°C/W

Freescale Semiconductor, Inc.

For More Information On This Product,

Go to: www.freescale.com

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