H5GQ2H24AFR-R0C datasheet(125/172 Pages) HYNIX

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This document is a general product description and is subject to change without notice. Hynix Semiconductor does not assume any

responsability for use of circuits described. No patent licenses are implied.

Rev. 1.2 /Nov. 2011

125

H5GQ2H24AFR

6. OPERATING CONDITIONS

6.1. ABSOLUTE MAXIMUM RATINGS

Voltage on Vdd Supply

Relative to Vss................................................... ‐0.5V to +2.0V

Voltage on VddQ Supply

Relative to Vss .................................................. ‐0.5V to +2.0V

Voltage on Vref and Inputs

Relative to Vss .................................................. ‐0.5V to +2.0V

Voltage on I/O Pins

Relative to Vss .................................................. ‐0.5V to VddQ +0.5V

Storage Temperature (plastic) ............................ ‐55°C to +150°C

Short Circuit Output Current ............................. 50mA

*Stresses greater than those listed may cause permanent damage to the device. This is a stress rating only, and functional operation of

the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.

Exposure to absolute maximum rating conditions for extended periods may affect reliability.

Table 37 Capacitance

PARAMETER

SYMBOL

MIN

MAX

UNITS

NOTES

Delta Input/Output Capacitance: DQs, DBI#, EDC,

WCK, WCK#

DCio

‐

0.6

Delta Input Capacitance: Command and Address

DCi1

‐

0.6

Delta Input Capacitance: CK, CK#

DCi2

‐

0.3

Input/Output Capacitance: DQs, DBI#, EDC, WCK,

WCK#

Cio

‐

2.1

Input Capacitance: Command and Address

Ci1

‐

1.8

Input Capacitance: CK, CK#, WCK, WCK#

Ci2

‐

1.8

Input Capacitance: CKE#

Ci3

‐

1.8

Table 38 Thermal Characteristics

Parameter

Description

Value

Units

Notes

Theta_JA

Thermal resistance junction to ambient

32.5

oC/W

1,2,3,4

Theta_JB

Thermal resistance junction to board

15.6

oC/W

1,2,5

Theta_JC

Thermal resistance junction to case

5.3

oC/W

1,5

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