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H5GQ2H24AFR-R0C 数据表(PDF) 162 Page - Hynix Semiconductor |
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H5GQ2H24AFR-R0C 数据表(HTML) 162 Page - Hynix Semiconductor |
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162 / 172 page  This document is a general product description and is subject to change without notice. Hynix Semiconductor does not assume any responsability for use of circuits described. No patent licenses are implied. Rev. 1.2 /Nov. 2011 162 H5GQ2H24AFR 7.3. PACKAGE OUTLINE Figure 83. Package Dimensions2 Notes: 1) GDDR5 package size, height and standoff specification is compliant to MO‐207 Rev L, variation DAA‐z 2) All demensions in mm unless otherwise noted. Table 56. Package Parameters Max Nominal Variation pkgx 12.0 pkgy 14.0 pkgstandoff 0.350 +/‐ 0.050 pkgheight 1.100 +/‐ 0.100 TOP VIEW SIDE VIEW pkgstandoff pkgheight BOTTOM VIEW (170 ball) 13x0.8=10.4 5x0.8=4.0 0.8 12 pkgx U T R p N M L K J H G F E D C B A 170 x |
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