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CS5530 数据表(PDF) 238 Page - National Semiconductor (TI) |
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CS5530 数据表(HTML) 238 Page - National Semiconductor (TI) |
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238 / 241 page ![]() www.national.com 238 Revision 4.1 6.0 Mechanical Specifications Mechanical dimensions for the 352-Terminal TBGA (Tape Ball Grid Array) package for the Geode CS5530 are pro- vided in this section. Table 6-1 provides the values for the dimensions given in Figure 6-1. Table 6-1. 352 TBGA Package Dimension Symbol Millimeters Minimum Nominal Maximum A-- -- 1.7 A1 0.5 0.6 0.7 A2 -- -- 1.0 b 0.60 0.75 0.90 D 35.0 BSC D1 31.75 BSC D2 33.4 33.6 33.8 D3 17.9 18.1 18.3 D4 15.4 15.6 15.8 E 35.0 BSC E1 31.75 BSC E2 33.4 33.6 33.8 E3 17.9 18.1 18.3 E4 15.4 15.6 15.8 e 1.27 BSC s 0.635 BSC aaa 0.15 Die Size < or = 12 |
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