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PC87373 数据表(PDF) 6 Page - National Semiconductor (TI)

[Old version datasheet] Texas Instruments acquired National semiconductor.
部件名 PC87373
功能描述  LPC SuperI/O with Glue Functions
PDF  174 Pages
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制造商  NSC [National Semiconductor (TI)]
网页  http://www.national.com
标志 NSC - National Semiconductor (TI)

PC87373 数据表(HTML) 6 Page - National Semiconductor (TI)

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Revision 1.1
Table of Contents
1.0
Signal/Pin Connection and Description
1.1
CONNECTION DIAGRAMS
................................................................................................ 13
1.2
BUFFER TYPES AND SIGNAL/PIN DIRECTORY .................................................................... 14
1.3
PIN MULTIPLEXING ................................................................................................................. 15
1.4
DETAILED SIGNAL/PIN DESCRIPTIONS ................................................................................ 16
1.4.1
LPC Interface ..............................................................................................................16
1.4.2
Serial Port 1 and Serial Port 2 (UART1 and UART2)
............................................. 17
1.4.3
Parallel Port
..............................................................................................................18
1.4.4
Floppy Disk Controller (FDC)
.................................................................................... 19
1.4.5
Keyboard and Mouse Controller (KBC)
..................................................................... 20
1.4.6
Game Port (GMP) ...................................................................................................... 20
1.4.7
Musical Instrument Digital Interface (MIDI) Port ........................................................ 20
1.4.8
General-Purpose I/O (GPIO) ...................................................................................... 21
1.4.9
Fan Speed Control and Monitor (FSCM) ................................................................... 21
1.4.10
System Wake-Up Control (SWC)
.............................................................................. 22
1.4.11
Clocks
..................................................................................................................... 22
1.4.12
Glue Functions ........................................................................................................... 23
1.4.13
Configuration Straps and Testing ............................................................................... 24
1.4.14
Power and Ground
.................................................................................................... 25
1.5
INTERNAL PULL-UP AND PULL-DOWN RESISTORS ............................................................ 25
2.0
Power, Reset and Clocks
2.1
POWER ..................................................................................................................................... 27
2.1.1
Power Planes .............................................................................................................. 27
2.1.2
Power States ...............................................................................................................27
2.1.3
Power Connection and Layout Guidelines .................................................................. 28
2.2
RESET SOURCES AND TYPES ............................................................................................... 29
2.2.1
VBAT Power-Up Reset ................................................................................................. 30
2.2.2
VSB Power-Up Reset .................................................................................................. 30
2.2.3
VDD Power-Up Reset .................................................................................................. 30
2.2.4
Hardware Reset ........................................................................................................... 30
2.2.5
Software Reset ............................................................................................................ 31
2.3
CLOCK DOMAINS ..................................................................................................................... 31
2.3.1
LPC Domain ................................................................................................................ 31
2.3.2
48 MHz Domain ........................................................................................................... 31
2.3.3
32 KHz Domain ........................................................................................................... 32
2.4
TESTABILITY SUPPORT ..........................................................................................................32
2.4.1
ICT ............................................................................................................................... 32
2.4.2
XOR Tree Testing ........................................................................................................ 33
3.0
Device Architecture and Configuration
3.1
OVERVIEW ............................................................................................................................... 34
3.2
CONFIGURATION STRUCTURE AND ACCESS ..................................................................... 34
3.2.1
The Index-Data Register Pair ...................................................................................... 34
3.2.2
Banked Logical Device Registers Structure ................................................................ 35



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