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LAN9252/ML 数据表(PDF) 28 Page - Microchip Technology |
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LAN9252/ML 数据表(HTML) 28 Page - Microchip Technology |
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28 / 329 page ![]() LAN9252 DS00001909A-page 28 2015 Microchip Technology Inc. Note 11: Refer to Section 4.0, "Power Connections," on page 29, the device reference schematic, and the device LANCheck schematic checklist for additional connection information. TABLE 3-14: JTAG PIN DESCRIPTIONS Num Pins Name Symbol Buffer Type Description 1 JTAG Test Mux Select TMS VIS JTAG test mode select 1 JTAG Test Clock TCK VIS JTAG test clock 1 JTAG Test Data Input TDI VIS JTAG data input 1 JTAG Test Data Output TDO VO12 JTAG data output TABLE 3-15: CORE AND I/O POWER PIN DESCRIPTIONS Num Pins Name Symbol Buffer Type Description 1 Regulator +3.3 V Power Supply VDD33 P +3.3 V power supply for internal regulators. See Note 11. Note: +3.3 V must be supplied to this pin even if the internal regulators are disabled. 5 +1.8 V to +3.3 V Variable I/O Power VDDIO P +1.8 V to +3.3 V variable I/O power. See Note 11. 3 +1.2 V Digital Core Power Supply VDDCR P Supplied by the on-chip regulator unless configured for regulator off mode via REG_EN. 1 µF and 470 pF decoupling capacitors in parallel to ground should be used on pin 6. See Note 11. 1 pad Ground VSS P Common ground. This exposed pad must be con- nected to the ground plane with a via array. |
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