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PC87373 数据表(PDF) 170 Page - National Semiconductor (TI) |
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PC87373 数据表(HTML) 170 Page - National Semiconductor (TI) |
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170 / 174 page ![]() 13.0 Device Characteristics (Continued) 170 www.national.com Revision 1.1 13.4.8 Glue Function Timing Highest Active Main and Standby Supply Reference Figure 54. REF5V and REF5V_STBY (AC Characteristics) Resume Reset Symbol Figure Description Reference Conditions Min Max Main tPD 54 VDD3 to REF5V Propagation Delay 1 1. Not tested. Guaranteed by design. VDD5 =0;VDD3 slew rate > 10 V/ms 1ms Standby tPD 54 VSB3 to REF5V_STBY Propagation Delay 1 VSB5 =0;VSB3 slew rate > 10 V/ms 1ms Symbol Figure Description Reference Conditions Min Max Units tRD 55 Rising Supply Delay1 (typ. 32 ms) 1. Not tested. Guaranteed by characterization. VSB5 >VTRIP or VSB3 >VSB3ON 10 100 ms tFD5 55 Falling VSB5 Supply Delay 1 VSB5 <VTRIP and VSB3 >VSB3ON 100 ns tGA 55 VSB5 and VSB3 Glitch Allowance 1 VSB5 <VTRIP or VSB3 <VSB3ON 100 ns tFD3 55 Falling VSB3 Supply Delay 1 VSB3 <VSB3ON and VSB5 >VTRIP TBD ns tR 55 Rise Time2 2. Not tested. Guaranteed by design. VSB3 >VSB3ON 100 ns tF 55 Fall Time2 VSB3 >VSB3ON 100 ns tPD 0V 1.5V 3.3V VDD3, VSB3 REF5V, REF5V_STBY tPD |
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