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PC87373 数据表(PDF) 155 Page - National Semiconductor (TI)

[Old version datasheet] Texas Instruments acquired National semiconductor.
部件名 PC87373
功能描述  LPC SuperI/O with Glue Functions
PDF  174 Pages
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制造商  NSC [National Semiconductor (TI)]
网页  http://www.national.com
标志 NSC - National Semiconductor (TI)

PC87373 数据表(HTML) 155 Page - National Semiconductor (TI)

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13.0 Device Characteristics (Continued)
155
www.national.com
Revision 1.1
13.2.7 Output, TTL/CMOS Compatible, Push-Pull Buffer
Symbol: Op/n
Output, TTL/CMOS Compatible, rail-to-rail push-pull buffer that is capable of sourcing p mA and sinking n mA
13.2.8 Output, TTL/CMOS Compatible, Open-Drain Buffer
Symbol: ODn
Output, TTL/CMOS-compatible open-drain output buffer capable of sinking n mA. Output from these signals is open-
drain and is never forced high.
13.2.9 Output, PCI 3.3V Compatible
Symbol: OPCI
13.2.10Analog Output
Symbol: AO
Symbol
Parameter
Conditions
Min
Max
Unit
VOH
Output High Voltage
IOH = −p mA
2.4
V
IOH = −50 µA
VSUP − 0.2
1
1. VSUP is VDD3 or VSB3 according to the output power well.
V
VOL
Output Low Voltage
IOL = n mA
0.4
V
IOL =50 µA
0.2
V
Symbol
Parameter
Conditions
Min
Max
Unit
VOL
Output Low Voltage
IOL = n mA
0.4
V
IOL =50 µA
0.2
V
Symbol
Parameter
Conditions
Min
Max
Unit
VOH
Output High Voltage
lout = −500 µA
0.9 VDD3
V
VOL
Output Low Voltage
lout = 1500 µA
0.1 VDD3
V
Symbol
Parameter
Conditions
Min
Max
Unit
VOR
Output Voltage Range
0
5.51
1. Not tested. Guaranteed by characterization.
V
VOD
Output Drive Voltage
lout = −3.6 mA
VSUP
2
− 150 mV
2. VSUP is VDD3 or VSB3 according to the pin power well.
lOL
Output Leakage Current
VOUT =VOR,VSUP <VOUT
203
3. This buffer type is excluded from the pins for which the total pins leakage of the device is maximum 10
µA.
Not tested. Guaranteed by characterization.
µA



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