PC87373 datasheet(158/174 Pages) NSC

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13.0 Device Characteristics (Continued)

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Revision 1.1

13.4 AC ELECTRICAL CHARACTERISTICS

13.4.1 AC Test Conditions

Figure 46. AC Test Conditions, TA =0°Cto70°C, VSUP = 3.3V ±10%

Notes:

1. VSUP is either VDD3 or VSB3, according to the pin power well.

2. CL = 50 pF for all output pins except the following pin groups:

−

CL = 100 pF for Serial Port 1 and 2 pins (see Section 1.4.2 on page 17), Parallel Port pins (see Section 1.4.3) and

Floppy Disk Controller pins (see Section 1.4.4)

−

CL = 40 pF for IDE_RSTDRV pin

−

CL = 400 pF for SMBus pins (see SMBus Voltage Translation and Isolation Timing on page 172)

These values include both jig and oscilloscope capacitance.

3. S1 = Open − for push-pull output pins.

S1 = VSUP − for high-impedance to active low and active low to high impedance transition measurements

S1 = GND − for high-impedance to active high and active high to high impedance transition measurements

RL = 1.0 KΩ− for all the pins

4. For the FDC open-drain interface pins, S1 = VDD3 and RL = 150Ω.

Device

Under

Test

0.1

µf

Input

Output

Load Circuit

AC Testing Input, Output Waveform

VSUP

2.4

0.4

2.0

0.8

Test Points

2.0

0.8

(unless otherwise speciﬁed)

PC87373 数据表(PDF) 158 Page - National Semiconductor (TI)

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